The　significant　difference　between　failure　modes　of　lead-containing　and　lead-free　solder　joints　under　drop　impact　loading　remains　to　be　not　well　understood.　In　this　paper,　we　propose　a　feasible　finite　element　approach　to　model　the　cracking　behavior　of　solder　joints　under　drop　impact　loading.　In　the　approach,　the　intermetallic　compound　layer/solder　bulk　interface　is　modeled　by　the　cohesive　zone　model,　and　the　crack　driving　force　in　the　intermetallic　compound　layer　is　evaluated　by　computing　the　energy　release　rate.　The　numerical　simulation　of　a　board　level　package　under　drop　impact　loading　shows　that,　for　the　lead-containing　Sn37Pb　solder　joint,　the　damage　in　the　vicinity　of　the　intermetallic　compound　layer　initiates　earlier　and　is　much　greater　than　that　in　the　lead-free　Sn3.5Ag　solder　joint.　This　damage　relieves　the　stress　in　the　intermetallic　compound　layer　and　reduces　the　crack　driving　force　in　it　and　consequently　alleviates　the　risk　of　the　intermetallic　compound　layer　fracturing.　[DOI:　10.1115/1.4004870]