Micro-sized　Cu　or　Ni　reinforcing　particles　were　incorporated　into　the　eutectic　Sn-3.5Ag　solder　to　form　metal　particles　enhanced　SnAg　based　composite　solder.　The　morphologies　of　the　intermetallic　compounds　(IMCs)　formed　around　reinforcing　particulates　in　composite　solder　under　different　processing　conditions,　and　the　mechanical　properties　of　composite　solder　joints　were　investigated.　Results　show　that　the　morphology　of　Ni　particles　develops　from　＂sunflower＂　to　＂blocky＂　morphology　with　the　decreasing　of　heating　rate,　and　the　different　heating　rates　have　no　influence　on　the　morphology　of　the　IMCs　formed　around　Cu　reinforcing　particulate.　Besides,　the　different　cooling　rates　have　no　influence　on　the　morphologies　of　IMCs.　Moreover,　evolution　of　the　morphologies　of　IMCs　around　reinforcing　particles　and　the　shear　strength　of　composite　solder　joints　were　analyzed　under　different　processing　conditions.