The　growth　behavior　of　interfacial　intermetallic　compounds　(IMCs)　of　SnAgCu/Cu　soldered　joints　was　investigated　during　the　reflow　process,　isothermal　aging,　and　thermal　cycling　with　a　focus　on　the　influence　of　these　parameters　on　growth　kinetics.　The　SnAgCu/Cu　soldered　joints　were　isothermally　aged　at　125　degrees　C,　150　degrees　C,　and　175　degrees　C　while　the　thermal　cycling　was　performed　within　the　temperature　ranges　from　-25　degrees　C　to　125　degrees　C　and　-40　degrees　C　to　125　degrees　C.　It　was　observed　that　a　Cu(6)Sn(5)　layer　formed,　followed　by　rapid　coarsening　at　the　solder/Cu　interface　during　reflowing.　The　grain　size　of　the　interfacial　Cu(6)Sn(5)　was　found　to　increase　with　aging　time,　and　the　morphology　evolved　from　scallop-like　to　needle-like　to　rod-like　and　finally　to　particles.　The　rod-like　Ag(3)Sn　phase　was　formed　on　the　solder　side　in　front　of　the　previously　formed　Cu(6)Sn(5)　layer.　However,　when　subject　to　an　increase　of　the　aging　time,　the　Cu(3)Sn　phase　was　formed　at　the　interface　of　the　Cu(6)Sn(5)　layer　and　Cu　substrate.　The　IMC　growth　rate　increased　with　aging　temperature　for　isothermally　aged　joints.　During　thermal　cycling,　the　thickness　of　the　IMC　layer　was　found　to　increase　with　the　number　of　thermal　cycles,　although　the　growth　rate　was　slower　than　that　for　isothermal　aging.　The　dwell　time　at　the　high-temperature　end　of　the　thermal　cycles　was　found　to　significantly　influence　the　growth　rate　of　the　IMCs.　The　growth　of　the　IMCs,　for　both　isothermal　aging　and　thermal　cycling,　was　found　to　be　Arrhenius　with　aging　temperature,　and　the　corresponding　diffusion　factor　and　activation　energy　were　obtained　by　data　fitting.　The　tensile　strength　of　the　soldered　joints　decreased　with　increasing　aging　time.　Consequently,　the　fracture　site　of　the　soldered　joints　migrated　from　the　solder　matrix　to　the　interfacial　Cu(6)Sn(5)　layer.　Finally,　the　shear　strength　of　the　joints　was　found　to　decrease　with　both　an　increase　in　the　number　of　thermal　cycles　and　a　decrease　in　the　dwell　temperature　at　the　low　end　of　the　thermal　cycle.