The　impact　behavior　of　solder　joints　was　studied　using　three　different　high-velocity　impact　tests:　the　U-notch　Charpy　impact　test,　the　no-notch　Charpy　impact　test,　and　a　laboratory-designed　drop　test.　The　solder　joints　were　made　of　five　solder　alloys,　Sn-37Pb,　Sn-3.8Ag-0.7Cu,　Sn-2.0Ag-0.7Cu,　Sn-1.0Ag-0.7Cu,　and　Sn-0.7Ag-0.7Cu　(in　wt.%),　in　which　the　traditional　Cu/solder/Cu　butt　joint　was　used.　All　three　impact　tests　gave　the　same　trend　of　the　impact　behavior　of　the　solder　joints,　with　the　Sn-37Pb　joints　having　the　highest　impact　resistance　and　the　Sn-3.8Ag-0.7Cu　joints　having　the　lowest　impact　resistance.　For　the　lead-free　joints,　the　Sn-1.0Ag-0.7Cu　joints　had　better　impact　resistance　than　the　Sn-2.0Ag-0.7Cu　joints,　and　the　Sn-2.0Ag-0.7Cu　joints　better　than　the　Sn-0.7Ag-0.7Cu　joints.　The　impact　behavior　was　correlated　well　to　the　fracture　morphologies　observed　by　scanning　electron　microscopy　(SEM).　Comparison　of　the　three　tests　showed　that　the　no-notch　Charpy　impact　test　is　a　promising　method　for　evaluating　the　drop　performance　of　solder　joints.