The　lab-designed　drop　tests　and　the　pendulum-type　impact　tests　were　used　to　study　the　effect　of　high-velocity　impact　on　the　fracture　morphologies　of　the　Sn3.8Ag0.7Cu　(wt.　%)　solder　joints.　The　U-notch　butted-type　specimen　was　selected.　The　typical　fracture　morphologies　created　by　the　high-velocity　tests　were　compared.　It　is　believed　that　the　large　Ag(3)Sn　platelets　precipitated　at　the　Cu/solder　interfaces　after　air　cooling　provided　the　initiation　site　for　cracking　and　caused　the　brittle　fracture.　Using　SEM,　the　fracture　morphologies　along　the　interfacial　Ag(3)Sn　intermetallic　compounds　(IMCs)　were　observed　on　the　fracture　surfaces.　The　results　showed　that　the　fracture　morphologies　were　a　function　of　the　stress　state　and　the　orientation　of　the　Ag(3)Sn　platelets　within　the　solder　joints　strongly　influenced　the　fracture　morphology.