The　morphology　evolution　of　intermetallic　compounds　(IMC)　in　Cu/SnBi/Cu　solder　joint　after　current　stressing　at　the　current　density　of　8x10(3),　1x10(4)　and　1.2x10(4)　A/cm(2)　for　80　h　was　investigated.　Results　indicate　that　when　the　current　density　was　8x10(3)　A/cm(2),　a　lot　of　irregular-shaped　IMCs　were　observed　at　the　anode　interface;　however,　there　was　no　obvious　IMC　formation　at　the　cathode　interface.　When　the　current　density　was　1x10(4)　A/cm(2),　scallop-shaped　IMC　layer　was　formed　at　the　cathode　interface,　and　some　of　them　had　spalled　from　the　interface;　while　at　the　anode　interface,　the　lamellar　IMC　was　formed,　and　it　was　thinner　than　that　at　the　cathode　interface.　When　the　current　density　was　1.2x10(4)　A/cm(2),　the　thickness　of　the　IMC　layer　at　the　anode　interface　increased.　Nevertheless,　the　IMC　at　the　cathode　interface　had　diffused　and　migrated　towards　the　solder　matrix,　which　made　the　cathode　interface　uneven.　It　should　be　noted　that,　with　the　current　density　increasing,　the　thickness　of　Bi　layer　forming　at　the　anode　side　increased　greatly.