In　this　paper,　microstructural　evolution　of　eutectic　SnBi　solder　joint　with　current　density　of　1.5x10(4)　A/cm(2)　after　current　stressing　for　10　min　and　30　min　respectively.　Microview　MVC2000　image　collector　was　applied　to　monitor　the　microstructural　evolution　of　the　solder　joint　during　experimental　process.　Local　melting　of　the　solder　joint　occurred　after　current　stressing　for　110　s,　and　then　it　was　in　molten　state　after　current　stressing　for　130　s.　Results　indicated　that　after　current　stressing　for　10min,　a　large　number　of　bump-shaped　Bi　phases　were　formed　near　the　anode　and　the　band-shaped　Bi　phases　were　form　near　the　cathode.　However　after　polishing,　the　microstructure　at　the　cathode　and　anode　remained　the　same.　Many　Bi　particles　were　formed　in　the　solder　matrix　and　voids　appeared　at　the　cathode　interface.　After　current　stressing　for　30　min,　the　uniform　microstructure　of　eutectic　SnBi　had　been　disturbed.　Bi　accumulation　occurred　at　the　anode,　and　cracks　appeared　in　the　Bi　accumulation　region.　It　should　be　noted　that　IMC　layer　at　the　anode　interface　was　thicker　that　that　at　the　cathode　interface　after　current　stressing.