This　paper　presents　some　experimental　observations　relative　to　the　influence　of　elevated　current　densities　on　the　intermetallic　growth　and　phase　evolution　in　Cu/Sn-58Bi/Cu　solder　joints.　Three　samples　were　stressed　with　different　current　densities　of　10(4),　1.2　x　10(4),　and　1.4　x　10(4)　A/cm(2),　respectively,　for　80　h.　The　abnormal　polarity　effect　of　electromigration　(EM)　on　chemical　reactions　at　the　cathode　and　the　anode　was　investigated　as　well　as　the　effect　of　EM　on　phase　segregation　in　the　two-phase　eutectic　microstructure.　Results　indicate　that　electric　current　enhances　the　growth　of　IMC　layer　at　the　cathode　and　retards　it　at　the　anode　due　to　the　Bi　accumulation　acting　as　a　barrier　layer　with　current　density　of　10(4)　A/cm(2).　However,　when　current　density　increases,　the　electrical　force　dissolves　the　IMC　at　the　cathode　into　the　solder.　More　and　more　intermetallic　precipitates　formed　due　to　the　dissolution　of　Cu　into　the　solder　at　the　cathode　side　with　increased　current　densities,　leading　to　a　very　different　morphology　at　the　anode　and　the　cathode　interfaces,　one　being　planar　and　the　other　being　very　irregular.　It　can　be　concluded　that　the　chemical　force　and　the　electrical　force　are　the　main　driving　forces　contributing　to　the　IMC　growth　at　both　interfaces.