Effect　of　current　stressing　on　whisker　growth　in　Cu/Sn-58Bi/Cu　solder　joints　was　investigated　with　current　densities　of　5　x　10(3)　and　10(4)　A/cm(2)　in　oven　at　different　temperatures.　Two　types　of　whiskers,　columnar-type　and　filament-type,　were　observed　on　the　solder　film　propagating　along　the　surface　of　the　Cu　substrate　and　at　the　cathode　interface,　respectively,　accompanied　with　many　hillocks　formation.　Typically,　these　whiskers　were　5-15　mu　m　in　length　and　0.06-2　mu　m　in　diameter.　EDX　revealed　that　these　whiskers　and　hillocks　were　mixtures　of　Sn　and　Bi　rather　than　single　crystal.　It　should　be　noted　that　the　sprouted　whiskers　would　not　grow　any　more　even　if　the　current-stressing　time　increased　again　when　the　solder　joint　was　stressed　under　lower　current　density.　Nevertheless,　when　the　current　density　was　up　to　10(4)　A/cm(2),　the　whiskers　would　melt　along　with　the　increasing　current-stressing　time.　Results　indicated　that　the　compressive　stress　generated　by　precipitation　of　Cu6Sn5　intermetallics　provides　a　driving　force　for　whisker　growth　on　the　solder　film,　and　the　Joule　heating　accumulation　should　be　responsible　for　whisker　growth　at　the　cathode　interface.