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Abstract:
The resistance of electronic interconnects made with Sn-based solders experiences significant deterioration during service in high-performance electronic products. During electromigration damage, metal atoms/ions can migrate in the direction of electron flow. Accordingly, accumulation of metal atoms/ions at the anode interface can induce surface bulging. On the other hand, depletion of metal atoms/ions at the cathode interface can induce surface dimpling. In addition, the different alpha-rich and beta-rich phases in a binary eutectic system were found to separate in the bulk region of eutectic Sn-Bi solder joints. Such atomic movement leads to complex interactions between the resistance changes of electronic solder joints during the different stages of electromigration. In order to clarify such scenarios, a LabVIEW(A (R))-controlled system was employed to quantitatively measure the instantaneous resistance values after an electric current was applied. This study investigated the effects of a high current density (10(4) A/cm(2)) at two different ambient temperatures (25A degrees C and 80A degrees C) on the deterioration of resistance changes during the early stage of the electromigration process.
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JOURNAL OF ELECTRONIC MATERIALS
ISSN: 0361-5235
Year: 2009
Issue: 12
Volume: 38
Page: 2756-2761
2 . 1 0 0
JCR@2022
ESI Discipline: MATERIALS SCIENCE;
JCR Journal Grade:2
CAS Journal Grade:1
Cited Count:
WoS CC Cited Count: 16
SCOPUS Cited Count: 16
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0