The　resistance　of　electronic　interconnects　made　with　Sn-based　solders　experiences　significant　deterioration　during　service　in　high-performance　electronic　products.　During　electromigration　damage,　metal　atoms/ions　can　migrate　in　the　direction　of　electron　flow.　Accordingly,　accumulation　of　metal　atoms/ions　at　the　anode　interface　can　induce　surface　bulging.　On　the　other　hand,　depletion　of　metal　atoms/ions　at　the　cathode　interface　can　induce　surface　dimpling.　In　addition,　the　different　alpha-rich　and　beta-rich　phases　in　a　binary　eutectic　system　were　found　to　separate　in　the　bulk　region　of　eutectic　Sn-Bi　solder　joints.　Such　atomic　movement　leads　to　complex　interactions　between　the　resistance　changes　of　electronic　solder　joints　during　the　different　stages　of　electromigration.　In　order　to　clarify　such　scenarios,　a　LabVIEW(A　(R))-controlled　system　was　employed　to　quantitatively　measure　the　instantaneous　resistance　values　after　an　electric　current　was　applied.　This　study　investigated　the　effects　of　a　high　current　density　(10(4)　A/cm(2))　at　two　different　ambient　temperatures　(25A　degrees　C　and　80A　degrees　C)　on　the　deterioration　of　resistance　changes　during　the　early　stage　of　the　electromigration　process.