This　study　was　concerned　with　the　effect　of　thermal　aging　on　the　impact　properties　of　solder　joints.　Three　kinds　of　solders,　conventional　Sn-37Pb　solder,　Sn-3.8Ag-0.7Cu　solder,　and　Sn-3.8Ag-0.7Cu　doped　with　rare-earth　(RE)　elements,　were　selected　to　manufacture　joint　specimens　for　the　Charpy　impact　test.　U-notch　specimens　were　adopted　and　isothermally　aged　at　150A　degrees　C　for　100　h　and　1000　h,　and　then　impacted　by　using　a　pendulum-type　impact　tester　at　room　temperature.　The　Sn-37Pb　solder　joints　exhibited　higher　performance　in　terms　of　impact　absorbed　energy　in　the　as-soldered　and　100　h　thermally　aged　conditions.　Interestingly,　the　Sn-3.8Ag-0.7Cu　solder　joints　exhibited　improved　performance　for　the　impact　value　after　1000　h　of　thermal　aging.　For　the　Sn-37Pb　and　Sn-3.8Ag-0.7Cu　solder　joints,　the　impact　absorbed　energies　initially　increased　when　the　storage　duration　was　limited　to　100　h,　and　then　gradually　decreased　with　its　further　increase.　For　the　Sn-3.8Ag-0.7Cu-RE　specimens,　impact　performance　decreased　directly　with　increasing　thermal　aging.　Furthermore,　scanning　electron　microscopy　(SEM)　observation　showed　that　the　fracture　paths　were　focused　on　the　interface　zone　for　the　three　kinds　of　joints　in　the　aged　conditions.　For　the　Sn-37Pb　joints,　the　fracture　surfaces　mainly　presented　a　ductile　fracture　mode.　For　the　Sn-3.8Ag-0.7Cu　joints,　with　microstructure　coarsening,　crack　propagation　partly　shifted　towards　the　Sn/Cu6Sn5　interface.　Compared　with　the　100　h　aged　joints,　the　area　fraction　of　intergranular　fracture　of　Sn　grains　on　the　Sn-3.8Ag-0.7Cu　fracture　surfaces　was　increased　when　the　aging　time　was　1000　h.　On　the　contrary,　the　fracture　morphologies　of　Sn-3.8Ag-0.7Cu-RE　were　mainly　brittle　as　thermal　aging　increased.　Thus,　an　interrelationship　between　impact　energy　value　and　fracture　morphology　was　observed.