Behavior　of　solder　joints　in　microelectronic　packages　is　crucial　to　the　drop　impact　reliability　design　of　mobile　electronic　products.　In　this　paper,　tensile　behaviors　of　Sn37Pb,　Sn3.5Ag,　and　Sn3.0Ag0.5Cu　at　strain　rates　of　600　s(-1),　1200　s(-1),　and　1800　s(-1)　were　investigated　using　the　split　Hopkinson　tensile　bar　experimental　technique.　Stress-strain　curves　of　the　three　solders　were　obtained,　and　microstructure　and　fractography　of　the　specimens　before　and　after　the　tests　were　examined　and　presented.　The　experimental　results　show　that　the　lead-free　solders　are　strongly　strain　rate　dependent:　Their　tensile　strength,　percent　elongation,　and　percent　reduction　in　area　are　much　greater　than　those　properties　of　the　lead-containing　solder　at　high　strain　rates.