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[期刊论文]

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

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Author:

He, Hongwen (He, Hongwen.) | Xu, Guangchen (Xu, Guangchen.) | Guo, Fu (Guo, Fu.) (Scholars:郭福)

Indexed by:

EI Scopus SCIE

Abstract:

Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC) was investigated with current density of 5 x 10(3) A/cm(2) at room temperature and 100 A degrees C, respectively. Results indicate that tiny RE addition to eutectic SnBi solder alloy can make the energy of interfaces and grain boundaries decrease, restrain the movement of dislocations and grain boundary sliding. Therefore, phase segregation and IMC growth will be effectively suppressed which enhances the electromigration resistance.

Author Community:

  • [ 1 ] [He, Hongwen]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Xu, Guangchen]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Guo, Fu]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [He, Hongwen]Beijing Univ Technol, Coll Mat Sci & Engn, 100 Ping Le Yuan, Beijing 100124, Peoples R China

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Source :

JOURNAL OF MATERIALS SCIENCE

ISSN: 0022-2461

Year: 2009

Issue: 8

Volume: 44

Page: 2089-2096

4 . 5 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:2

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 28

SCOPUS Cited Count: 31

30 Days PV: 2

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