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Author:

梅燕 (梅燕.) | 韩业斌 (韩业斌.) | 聂祚仁 (聂祚仁.) (Scholars:聂祚仁)

Indexed by:

PKU

Abstract:

化学机械抛光(CMP)技术作为目前唯一的可以提供在整个圆硅晶片上全面平坦化的工艺技术,已被越来越广泛地应用到了半导体领域.重点叙述了CMP技术背景、设备、抛光原理、发展现状、存在的问题以及未来的发展趋势.

Keyword:

浆料 硅片 化学机械抛光(CMP)技术

Author Community:

  • [ 1 ] [梅燕]北京工业大学
  • [ 2 ] [韩业斌]北京工业大学
  • [ 3 ] [聂祚仁]北京工业大学

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Source :

润滑与密封

ISSN: 0254-0150

Year: 2006

Issue: 9

Page: 206-212

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 36

Chinese Cited Count:

30 Days PV: 0

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