In　this　paper,　new　progress　in　manufacturing　technology　of　metallic　microspheres　all　over　the　world　is　reviewed.　The　theory　and　apparatus　of　uniform　droplet　spray　are　introduced　detailedly.　Furthermore　the　applications　and　their　merits　of　droplet-based　process　adopting　uniform　droplet　spray　are　presented.　At　the　end　of　this　paper　gives　a　brief　account　of　the　condition　of　producing　solder　ball　for　electronic　packaging　are　given.