A　Ni-based　tri-layer　composite　substrate　designed　as　a　substitute　for　traditional　substrate　architecture,　was　obtained　by　sintering　together　two　Ni-5　at.%W　layers　on　both　sides　of　a　metallurgically　prepared　powder　Ni-12　at.%W　inner　layer.　An　advanced　sparking　plasma　sintering　technology　was　used,　followed　by　cold　rolling　and　annealing.　The　composite　substrates　obtained　have　a　very　sharp　cube　texture　on　the　Ni-5　at.%W　outer　layer　and　the　yield　strength　exceeds　320　MPa,　while　the　magnetization　behaviour　was　dramatically　reduced.　These　properties　render　these　tri-layer　substrates　suitable　for　the　epitaxial　growth　of　buffer　layers　for　coated　conductor　applications.　(C)　2007　Acta　Materialia　Inc.　Published　by　Elsevier　Ltd.　All　rights　reserved.