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Author:

Guo, Fu (Guo, Fu.) (Scholars:郭福)

Indexed by:

EI Scopus SCIE

Abstract:

Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.

Keyword:

Author Community:

  • [ 1 ] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100022, Peoples R China

Reprint Author's Address:

  • 郭福

    [Guo, Fu]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100022, Peoples R China

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Source :

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

ISSN: 0957-4522

Year: 2007

Issue: 1-3

Volume: 18

Page: 129-145

2 . 8 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 106

SCOPUS Cited Count: 120

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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