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Author:

许仕龙 (许仕龙.) | 朱满康 (朱满康.) | 黄安平 (黄安平.) | 王波 (王波.) (Scholars:王波) | 严辉 (严辉.)

Indexed by:

CQVIP PKU CSCD

Abstract:

采用磁控溅射法,在衬底温度为620°C时,通过引入合适的衬底负偏压(100~200V),获得了结晶良好的Ta2O5薄膜.衬底负偏压增强了正离子对衬底表面的轰击作用,加速了其在衬底表面的松弛扩散效应,从而降低了Ta2O5薄膜的晶化温度,改善了其结晶性.同时,C-V测试结果表明:衬底负偏压进一步改善了Ta2O5薄膜的介电性能.

Keyword:

晶化温度 Ta2O5 衬底负偏压 介电薄膜

Author Community:

  • [ 1 ] [许仕龙]北京工业大学
  • [ 2 ] [朱满康]北京工业大学
  • [ 3 ] [黄安平]北京工业大学
  • [ 4 ] [王波]北京工业大学
  • [ 5 ] [严辉]北京工业大学

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Source :

无机材料学报

ISSN: 1000-324X

Year: 2004

Issue: 3

Volume: 19

Page: 701-704

1 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:4

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 2

Chinese Cited Count:

30 Days PV: 1

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