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作者:

Hao Hu (Hao Hu.) | Tian Jun (Tian Jun.) | Shi Yaowu (Shi Yaowu.) | Lei Yongping (Lei Yongping.) (学者:雷永平) | Xia Zhidong (Xia Zhidong.)

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EI Scopus SCIE PKU CSCD

摘要:

In the present paper the effect of trace amount rare earth Y on the microstructure and the performance of Sn3.8Ag0.7Cu solder alloy has been systematically investigated Through measurement of melting temperature, wettability and joint shear strength, and observation of microstructure, it is indicated that the SnAgCuY alloy containing rare earth Y is a lead-free solder with excellent performances. At the same time the best content of Y was deter-mined.

关键词:

lead-free solder rare earth Y SnAgCu alloy

作者机构:

  • [ 1 ] Beijing Univ Technol, Sch Mat Sci & Engn, Lab Adv Elect Joining Mat, Beijing 100022, Peoples R China

通讯作者信息:

  • [Hao Hu]Beijing Univ Technol, Sch Mat Sci & Engn, Lab Adv Elect Joining Mat, Beijing 100022, Peoples R China

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来源 :

RARE METAL MATERIALS AND ENGINEERING

ISSN: 1002-185X

年份: 2006

卷: 35

页码: 121-123

0 . 7 0 0

JCR@2022

ESI学科: MATERIALS SCIENCE;

JCR分区:3

被引次数:

WoS核心集被引频次: 14

SCOPUS被引频次:

ESI高被引论文在榜: 0 展开所有

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