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[期刊论文]
热应力条件下VLSI金属化布线的可靠性
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Translated Title
IMPACT OF TEMPERATURE GRADIENT ON ELECTROMIGRATION CHARACTERISTICS IN VLSI METALLIZATION
Translated Abstract
Translated Keyword
RELIABILITYMETALLIZATIONTEMPERATURE GRADIENTELECTROMIGRATIONVLSI
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TN47
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WF:perioarticalQK199800404182
Language
Chinese
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Source :
微电子学
ISSN: 1004-3365
Year: 1998
Page: 59-63
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WoS CC Cited Count: 0
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ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: -1
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30 Days PV: 0
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