In　this　paper,　a　three-dimensional　model　of　Ceramic　Column　Grid　Array　(CCGA)　package　is　established　by　finite　element　method,　and　the　reliability　of　copper　pillar　bumps　under　the　five　manufacturing　processes　of　copper　pillar　plating,　solder　joint　welding,　underfill　filling,　thermal　paste　filling　and　cover　sealing　is　analyzed.　Finally,　this　paper　provides　guidance　for　the　optimization　of　fabrication　process　based　on　the　results　of　finite　element　simulation.　The　results　show　that　the　stress　and　strain　values　of　the　solder　joints　are　relatively　large　due　to　the　higher　reflow　temperature;　relatively　large　warpage　values　are　generated　when　the　filler　and　the　thermal　paste　are　filled;　at　the　end　of　the　fabrication　process,　the　stress　accumulation　(von　Mises　stress)　of　the　copper　pillar　bumps　at　the　four　corners　of　the　package　is　maximized,　and　most　likely　to　fail.