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作者:

Ye Lezhi (Ye Lezhi.) | Wang Hongtao (Wang Hongtao.) | Wang Haiming (Wang Haiming.) | Li Desheng (Li Desheng.) (学者:李德胜)

收录:

CPCI-S

摘要:

In the point-to-point high-speed positioning process of the IC packaging mechanism, the nonlinear characteristics of the servo system influence the performance of the servo system to a different extent, which may easily cause resonance of the system and reduce die attach efficiency of the packaging equipment. Based on the above problems, this paper proposes a cross-global artificial bee PID algorithm to suppress mechanical resonance at the load end. Firstly, the reasons of resonance formation and the influence on the servo system are analyzed. Secondly, the modal of the swing arm mechanism in the IC packaging mechanism is analyzed. Finally, the experimental platform is built. The results show that the resonance of the load end is effectively controlled and the positioning efficiency is improved by 9.1%.

关键词:

cross-artificial bee PID resonance suppression IC packaging mechanism modal analysis

作者机构:

  • [ 1 ] [Ye Lezhi]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Wang Hongtao]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Li Desheng]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Wang Haiming]CETC Beijing Elect Equipment Co Ltd, Beijing 100176, Peoples R China

通讯作者信息:

  • [Ye Lezhi]Beijing Univ Technol, Beijing 100124, Peoples R China

电子邮件地址:

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来源 :

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

年份: 2018

页码: 100-103

语种: 英文

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