In　the　electronic　manufacturing　industry,　solder　paste　plays　a　more　and　more　important　role,　and　its　performance　directly　affect　the　quality　of　the　electronic　products.　The　performance　of　the　low　silver　lead-free　solder　paste　which　is　developed　in　the　lab　is　degenerate　during　the　storage.　The　viscosity　gets　increasing,　the　surface　becomes　little　dry,　and　printing　performance　would　decline.　Meanwhile,　wettability　and　stability　are　also　falling.　In　this　paper,　we　study　the　mechanism　of　the　performance　degeneration　through　exploring　the　stability　and　solubility　of　the　organic　acid　surfactant　in　the　existing　solvent　system.　In　addition,　we　also　study　the　function　of　common　corrosion　inhibitor.　Research　results　show　that　in　the　existing　solvent　system,　the　solubility　of　succinic　acid　is　4.49%,　and　the　solubility　of　adipic　acid　is　3.95%.　Compared　with　triethanolamine,　benzene　and　three　azole　nitrogen　(BTA)　has　better　corrosion　resistant　performance.