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作者:

Zhang, Siyu (Zhang, Siyu.) | Feng, Shiwei (Feng, Shiwei.) (学者:冯士维) | An, Zhenfeng (An, Zhenfeng.) | Yang, Hongwei (Yang, Hongwei.) | Gong, Xueqin (Gong, Xueqin.) | Qiao, Yanbin (Qiao, Yanbin.)

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CPCI-S

摘要:

The degradation mechanism of 808 nm GaAs-based high-power laser diode bars (LDBs) which has 47 single laser diodes is investigated using infrared thermography, focused ion beam, high-resolution transmission electron microscopy, and energy-dispersive X-ray spectroscopy techniques. We obtained the temperature distribution of the output facet and the results indicate that emitter 24, which is located at the center of the bar chip, exhibits the highest facet temperature, that is, 37.87 degrees C and 42.08 degrees C at operating currents of 20 A and 25 A, respectively. Thus, we made a sample of emitter 24 that was then studied in detail. The facet coating of this sample changed and degraded visibly in both constituent and thickness, which eventually resulted in the catastrophic optical damage (COD) of its output facet. We deduce that we can improve the performance and reliability of LDBs through optimizing their facet coatings.

关键词:

semiconductor laser diode bars reliability facet coating catastrophic optical damage thermal infrared imaging

作者机构:

  • [ 1 ] [Zhang, Siyu]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing, Peoples R China
  • [ 3 ] [An, Zhenfeng]Hebei Semicond Inst, Dept Laser Diodes, Shijiazhuang, Hebei, Peoples R China
  • [ 4 ] [Yang, Hongwei]Hebei Semicond Inst, Dept Laser Diodes, Shijiazhuang, Hebei, Peoples R China
  • [ 5 ] [Gong, Xueqin]Chinese Acad Sci, Inst Microelect, R&D Ctr Silicon Device & Integrates Technol, Beijing, Peoples R China
  • [ 6 ] [Qiao, Yanbin]Beijing Smart Chip Microelect Technol Co Ltd, State Grid Key Lab Power Chip Designing & Anal Te, Beijing, Peoples R China

通讯作者信息:

  • 冯士维

    [Feng, Shiwei]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing, Peoples R China

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来源 :

2017 2ND IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS AND MICROSYSTEMS (ICICM)

年份: 2017

页码: 110-114

语种: 英文

被引次数:

WoS核心集被引频次: 36

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