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Author:

Li Fuping (Li Fuping.) | Meng Zhaoyang (Meng Zhaoyang.) | Liu Zhifeng (Liu Zhifeng.) (Scholars:刘志峰) | Liu Jianyong (Liu Jianyong.)

Indexed by:

CPCI-S

Abstract:

The spindle system of EDM is directly involved in the processing process, and its thermal deformation seriously affect the processing accuracy. In this paper, we can use the method of sequential coupling, which based on the software of Workbench ANSYS, to analyze the characteristics of thermal-structure coupling in the spindle system. The temperature field and thermal deformation of the spindle system have been calculated by the simulation. And the results of finite element analysis have been verified by experiments. The results show that the internal heat source of the spindle system has a serious influence on the temperature rise and thermal deformation, and the maximum thermal deformation occurred in the direction of X axis, while the thermal deformation of other direction is not significant to the thermal deformation of the spindle system. The analysis results lay the foundation for further improving the temperature field of the spindle system and reducing the thermal deformation, and it also provides a strong basis for the design of optimization and error compensation of the spindle system.

Keyword:

temperature field EDM thermal-structure coupling deformation Spindle thermal deformation

Author Community:

  • [ 1 ] [Li Fuping]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Meng Zhaoyang]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Liu Zhifeng]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Liu Jianyong]Beijing Inst Electro Machining, Beijing 100191, Peoples R China

Reprint Author's Address:

  • [Li Fuping]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

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Source :

PROCEEDINGS OF THE 2016 JOINT INTERNATIONAL INFORMATION TECHNOLOGY, MECHANICAL AND ELECTRONIC ENGINEERING

ISSN: 2352-5401

Year: 2016

Volume: 59

Page: 463-470

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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