In　this　paper,　cohesive　zone　modeling(CZM)　was　adopted　to　simulate　the　distribution　of　temperature　&　stress　field　and　the　interface　damage　on　the　Cu/EMC　double　adhesive　material　electronic　packaging.　The　following　phenomena　were　found:　A　sharp　rise　of　the　EMC　temperature　appeared　at　cut　portion　field　when　the　cutting　began,　while　it　had　little　effect　on　copperplate.　Stress　concentration　existed　at　the　cutting　surface　boundary,　and　the　maximum　value　occurred　at　the　top　of　the　copper　plate　which　had　exceed　the　yield　and　tensile　strength　of　the　viscoelastic　copper,　this　will　be　prone　to　drag　and　generate　burr　on　the　copper　surface.　Contact　surface　damage　occurred　mainly　in　first　time　step,　the　first　site　of　injury　occurred　in　the　medial　side　of　the　cutting　surface.　The　interfacial　tension　stress　was　smaller　than　the　maximum　normal　stress　set　up　by　CZM,　while　the　interface　tangential　stress　was　greater　than　the　maximum　tangential　contact　stress　that　the　material　can　bear,　which　would　cause　damage　to　the　bonding　interface.　Compared　with　normal　strain　energy　release　rate　due　to　separation　in　normal　direction　(mode　I　debonding),　shear　strain　energy　release　rate　due　to　separation　in　tangential　direction(mode　II　debonding)　was　larger,　but　it　did　not　reach　the　critical　strain　energy　release　rate　in　the　shear　directions.　The　contact　interface　was　not　completely　cracked　and　cracking　trend　was　mainly　mode　II　crack　in　this　case.