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Author:

Jia, Yunpeng (Jia, Yunpeng.) | Peng, Ling (Peng, Ling.) | Su, Hongyuan (Su, Hongyuan.) | Hu, Dongqing (Hu, Dongqing.) | Wu, Yu (Wu, Yu.)

Indexed by:

CPCI-S

Abstract:

Single event burnout (SEB) is a common single event effect (SEE) occur in VDMOSFET, previous studies have indicated the strong relationship between the device's secondary breakdown voltage and the SEB threshold voltage. This paper presents a grade doping buffer layer structure to improve the device's secondary breakdown voltage so that enhance the resistance to SEE. Through detailed simulation, it has been verified that optimized grade doping buffer layer can decrease the peak value of the electric field, significantly improve the parasitic bipolar turn-on current and the SEB threshold voltage. Moreover, compared to non-buffer layer and constant doping buffer layer structure, the optimized grade doping buffer structure is a more effective structure in SEE hardened VDMOSFET.

Keyword:

grade doping buffer layer VDMOSFET heavy ion SEE

Author Community:

  • [ 1 ] [Jia, Yunpeng]Beijing Univ Technol, Coll Elect Informat & Control Engn, Power Semicond & Integrated Circuit Lab, Beijing 100124, Peoples R China
  • [ 2 ] [Peng, Ling]Beijing Univ Technol, Coll Elect Informat & Control Engn, Power Semicond & Integrated Circuit Lab, Beijing 100124, Peoples R China
  • [ 3 ] [Su, Hongyuan]Beijing Univ Technol, Coll Elect Informat & Control Engn, Power Semicond & Integrated Circuit Lab, Beijing 100124, Peoples R China
  • [ 4 ] [Hu, Dongqing]Beijing Univ Technol, Coll Elect Informat & Control Engn, Power Semicond & Integrated Circuit Lab, Beijing 100124, Peoples R China
  • [ 5 ] [Wu, Yu]Beijing Univ Technol, Coll Elect Informat & Control Engn, Power Semicond & Integrated Circuit Lab, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Jia, Yunpeng]Beijing Univ Technol, Coll Elect Informat & Control Engn, Power Semicond & Integrated Circuit Lab, Beijing 100124, Peoples R China

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Source :

PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA)

ISSN: 1946-1550

Year: 2016

Page: 276-279

Language: English

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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