3D-IC　is　getting　increasingly　attractive,　as　it　improves　speed　and　frequency,　and　reduces　power　consumption,　noise　and　latency.　However,　three　dimension　(3D)　integration　technologies　bring　a　new　serious　challenge　to　chip　thermal　management　with　the　power　density　increased　exponentially.　Interlayer　microchannel　liquid　cooling　is　thought　as　a　promising　and　scalable　solution　for　cooling　high　heat　flux　3D-IC.　In　this　paper,　firstly　channel　number,　channel　width　and　height　parameters　of　rectangular　channel　are　optimized　by　the　method　of　multi-objective　parameter　optimization　under　given　overall　size　of　5mm　in　length　and　5mm　in　width.　The　results　show　the　total　thermal　resistances　can　reach　very　small　under　individual　constraint　condition　of　volume　flow　rates,　but　the　pressure　drop　is　too　larger　to　accept.　The　minimum　thermal　resistance　structure　can　be　got　by　multi-objective　optimization　at　various　constraint　conditions.　It　is　found　that　the　channel　height　and　width　increase　with　increasing　of　flow　rates　at　pumping　power　less　than　0.1W　and　pressure　drop　less　than　20kPa.　Secondly,　the　zigzag　channels　are　designed　on　the　basis　of　the　optimized　rectangular　channel　structure.　The　expansion　and　contraction　ratio　as　an　important　parameter　is　optimized　by　numerical　simulation.　The　thermal　enhancement　factor　and　Nusselt　number　measure　the　comprehensive　performances　of　heat　transfer.　The　results　show　heat　transfer　characteristic　is　enhanced　with　the　decreasing　of　expansion　and　contraction　ratio.　Besides,　the　maximum　junction　temperature　and　maximum　temperature　difference　are　also　reduced.　3D-IC　with　wave　channel　of　beta=3/7　is　more　promising　for　interlayer　cooling.