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作者:

Yu Huiping (Yu Huiping.) | Feng Feng (Feng Feng.) | Qin Fei (Qin Fei.) (学者:秦飞) | Wu Wei (Wu Wei.) | An Tong (An Tong.) | Chen Pei (Chen Pei.)

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CPCI-S

摘要:

The thermal-mechanical reliability of the flip-chip with copper pillar bump is analyzed through finite element numerical simulation and Kriging response surface models optimization method. The results show that: the successive order of factors affecting the chip warpage is: die thickness, bump pitch, die thickness, substrate thickness, Cu Pillar height, Cu Pillar height, PI thickness, PI opening size; the successive order of factors affecting the stress is: PI opening size, bump pitch, PI thickness, die thickness, Cu Pillar height, substrate thickness; the objectives and constraints are explicated through Kriging model. In Kriging model, the quadratic form is adopted as regression function, Gaussian function is chosen as correlative function, and sequential quadratic programming is used to solve the problem. After optimization, the first principal stress is decreased significantly on the Low-K layer; meanwhile, chip warpage is under control.

关键词:

response surface models optimization finite element numerical simulation copper pillar bump reliability

作者机构:

  • [ 1 ] [Yu Huiping]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 2 ] [Feng Feng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 3 ] [Qin Fei]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 4 ] [Wu Wei]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 5 ] [An Tong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 6 ] [Chen Pei]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China

通讯作者信息:

  • [Yu Huiping]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China

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来源 :

2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY

年份: 2015

语种: 英文

被引次数:

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