Electromigration　and　creep　as　two　of　the　most　important　reliability　issues　gain　much　attention,　and　flurry　of　academic　activities　dedicate　to　understand　fundamental　physics　of　them.　However,　since　real　solder　joints　are　usually　exposure　to　complicated　conditions　with　high　current　density,　temperature　excursion,　and　mechanical　loading,　when　analyzing　creep　of　a　real　solder　joint,　Electromigration　must　be　taken　into　account　because　of　the　interaction　between　them.　In　this　study,　simple　shear　to　failure　was　performed　at　different　temperature　and　stress　level　to　evaluate　failure　behavior　of　solder　joints.　Activation　energy　and　stress　exponent　under　high　current　density　were　also　calculated　and　discussed.　This　research　indicated　that,　strain　rate　was　accelerated　by　high　current　density　at　different　levels　of　stress　and　temperature.　The　effect　of　high　current　density　played　more　important　roles　at　low　stress　and　low　temperature　condition.　At　high　stress　and　high　temperature,　the　accelerating　effect　was　not　that　significance.　When　high　current　density　was　introduced,　both　activation　energy　and　stress　exponent　tend　to　decrease.