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摘要:
Through-silicon via (TSV) achieves interconnects of multiple dies in a 3D IC. Previous researches show that irregular TSV placement may cause reliability issues in manufacturing. Therefore, this paper forwards a TSV alignment design in acquiring an overlap-free near-regular TSV placement. This design features a TSV alignment algorithm which aligns an irregular TSV placement into a near-regular one. Experiments are conducted on 2D-3D transformation of IBM benchmark circuits. Results show that this design successfully realizes a near-regular overlap-free TSV placement.
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来源 :
PROCEEDINGS OF 2015 IEEE 11TH INTERNATIONAL CONFERENCE ON ASIC (ASICON)
ISSN: 2162-7541
年份: 2015
语种: 英文
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