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Author:

Guan, Jialiang (Guan, Jialiang.) | Zhu, Lili (Zhu, Lili.) | Zhu, Shenggen (Zhu, Shenggen.) | Ma, Xinqiang (Ma, Xinqiang.)

Indexed by:

CPCI-S EI Scopus

Abstract:

The influence of tool rake angle, feed rate and back cutting depth on the surface roughness and surface waviness of KDP crystal were studied when processing KDP crystal in the way of horizontal fly cutting. Comparing with the influence laws of vertical single point diamond fly cutting, we analyzed the respective advantages of the two kinds of cutting processing methods and summarized the similarities and differences of the influence rules that cutting parameters on surface quality under the two ways.

Keyword:

Horizontal fly cutting Surface quality Process parameter KDP crystal

Author Community:

  • [ 1 ] [Guan, Jialiang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Guan, Jialiang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

MACHINERY ELECTRONICS AND CONTROL ENGINEERING III

ISSN: 1660-9336

Year: 2014

Volume: 441

Page: 53-,

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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