The　reliability　issues　such　as　creep,　electromigration　(EM),　and　thermal　fatigue　of　solder　joints　in　real　service　condition　have　gained　much　attention　due　to　the　rapid　development　of　electronic　devices　towards　multi-function,　miniaturizing　and　portable　tendency.　There　are　many　studies　focusing　on　microstructure　changes　of　solder　joints　under　the　single　condition　of　creep,　EM,　or　thermal　fatigue.　However,　few　studies　focus　on　the　coupling　effect(s)　of　the　above　mentioned　impact　factors　during　the　failure　process　of　a　solder　joint.　In　this　study,　Sn-0.3Ag-0.7Cu　which　has　much　lower　cost　than　Sn-3.0Ag-0.5Cu　under　the　coupling　stressing　of　EM　and　creep　were　investigated.　The　in-situ　microstructure　and　resistance　of　the　solder　joints　were　observed　and　measured　during　the　failure　process.　The　results　indicated　that　the　lifetime,　the　fracture　location,　and　the　fracture　mode　of　solder　joint　were　significantly　changed　by　the　coupling　effect(s)　of　creep　and　EM.