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Abstract:
A 532nm Diode-Pumped green laser was used to cut glass with the Micro-Crack control. The "Micro-Crack" was the micron-sized round-like crack caused by laser in the glass and the line-crack around the round-like crack. This paper researched the generation of the Micro-Crack and discussed how to control it, then researched the stress field in the glass during the cutting by finite element analysis. Propose a new method about the glass cutting which had advantages of low power, low heat effect, irregular-curve cutting and slant cutting.
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Source :
MICRO-NANO TECHNOLOGY XIV, PTS 1-4
ISSN: 1013-9826
Year: 2013
Volume: 562-565
Page: 1408-1413
Language: English
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0