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作者:

Huang, Chao (Huang, Chao.) | Chen, Jimin (Chen, Jimin.) (学者:陈继民) | Yuan, Jianwen (Yuan, Jianwen.)

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摘要:

A 532nm Diode-Pumped green laser was used to cut glass with the Micro-Crack control. The "Micro-Crack" was the micron-sized round-like crack caused by laser in the glass and the line-crack around the round-like crack. This paper researched the generation of the Micro-Crack and discussed how to control it, then researched the stress field in the glass during the cutting by finite element analysis. Propose a new method about the glass cutting which had advantages of low power, low heat effect, irregular-curve cutting and slant cutting.

关键词:

Ansys Glass Cutting Irregular-Curve Cutting Laser Slant Cutting Stress Field

作者机构:

  • [ 1 ] [Huang, Chao]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Chen, Jimin]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Yuan, Jianwen]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

通讯作者信息:

  • [Huang, Chao]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

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来源 :

MICRO-NANO TECHNOLOGY XIV, PTS 1-4

ISSN: 1013-9826

年份: 2013

卷: 562-565

页码: 1408-1413

语种: 英文

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