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Author:

Huang, Chao (Huang, Chao.) | Chen, Jimin (Chen, Jimin.) (Scholars:陈继民) | Yuan, Jianwen (Yuan, Jianwen.)

Indexed by:

CPCI-S EI Scopus

Abstract:

A 532nm Diode-Pumped green laser was used to cut glass with the Micro-Crack control. The "Micro-Crack" was the micron-sized round-like crack caused by laser in the glass and the line-crack around the round-like crack. This paper researched the generation of the Micro-Crack and discussed how to control it, then researched the stress field in the glass during the cutting by finite element analysis. Propose a new method about the glass cutting which had advantages of low power, low heat effect, irregular-curve cutting and slant cutting.

Keyword:

Laser Stress Field Slant Cutting Irregular-Curve Cutting Ansys Glass Cutting

Author Community:

  • [ 1 ] [Huang, Chao]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Chen, Jimin]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Yuan, Jianwen]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Huang, Chao]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

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Source :

MICRO-NANO TECHNOLOGY XIV, PTS 1-4

ISSN: 1013-9826

Year: 2013

Volume: 562-565

Page: 1408-1413

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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