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摘要:
A 532nm Diode-Pumped green laser was used to cut glass with the Micro-Crack control. The "Micro-Crack" was the micron-sized round-like crack caused by laser in the glass and the line-crack around the round-like crack. This paper researched the generation of the Micro-Crack and discussed how to control it, then researched the stress field in the glass during the cutting by finite element analysis. Propose a new method about the glass cutting which had advantages of low power, low heat effect, irregular-curve cutting and slant cutting.
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