Tensile　specimens　with　a　Cu/IMC/solder/IMC/Cu　structure　were　prepared,　and　were　treated　by　0h,　72h,　168h,　288h,　500h,　1000h　isothermal　aging　processing　at　150　degrees　C.　Quasi-static　tensile　tests　were　conducted　on　the　micro-tester　Instron5948,　Fracture　analysis　of　fractured　specimens　was　conducted　by　optical　microscopy　and　scanning　electron　microscopy.　Two　fracture　modes　were　found,　and　the　fracturing　surface　tends　to　be　flat　with　the　aging　time　increases.