Cu-Ni-Si　alloys　are　widely　used　in　lead　frames　and　vacuum　devices　due　to　their　high　electrical　conductivity　and　strength.　In　this　paper,　a　Cu-Ni-Co-Si-Cr-(Ce)　alloy　was　prepared　by　vacuum　induction　melting.　Hot　compression　tests　of　the　Cu-Ni-Co-Si-Cr　and　Cu-Ni-Co-Si-Cr-Ce　alloys　were　carried　out　using　a　Gleeble-1500　simulator　at　500-900　degrees　C　deformation　temperatures　and　0.001-10　s(-1)strain　rates.　The　texture　change　was　analyzed　by　electron　backscatter　diffraction.　The　fiber　component　dominated　the　texture　after　compression,　and　the　texture　intensity　was　reduced　during　recrystallization.　Moreover,　the　average　misorientation　angle　phi　for　Cu-Ni-Co-Si-Cr-Ce　(11　degrees)　was　lower　than　that　of　Cu-Ni-Co-Si-Cr　(16　degrees)　under　the　same　conditions.　Processing　maps　were　developed　to　determine　the　optimal　processing　window.　The　microstructure　and　precipitates　of　the　Cu-Ni-Co-Si-Cr　and　Cu-Ni-Co-Si-Cr-Ce　alloys　were　also　analyzed.　The　average　grain　size　of　the　Cu-Ni-Co-Si-Cr-Ce　alloy　(48　mu　m)　was　finer　than　that　of　the　Cu-Ni-Co-Si-Cr　alloy　(80　mu　m).　The　average　size　of　precipitates　in　the　Cu-Ni-Co-Si-Cr　alloy　was　73　nm,　while　that　of　the　Cu-Ni-Co-Si-Cr-Ce　alloy　was　27　nm.　The　addition　of　Ce　delayed　the　occurrence　of　dynamic　recrystallization.