In　this　paper,　a　signal　integrity　aware　TSV　positioning　method　(SITP)　is　introduced.　Grounded　TSV　proved　to　help　eliminating　TSV-to-TSV　coupling.　A　trench　based　3D　IC　placement　method　is　developed,　transforming　2D　placement　into　3D　placement　and　perform　signal　TSV　placement　with　flexible　grounded　TSV　Insertion.　IBM　placement　benchmark　is　used　for　original　2D　placement.　By　evaluating　wire-length　and　runtime,　SITP　automatically　achieve　high　performance　3D　IC　placement　with　considerable　TSV-TSV　interference　elimination.