In　this　study,　the　board　level　solder　joint　reliability　analysis　and　fatigue　life　prediction　of　dual-row　QFN　package　are　carried　out.　The　effects　of　solder　constitutive　model　and　finite　element　(FE)　model　on　solder　fatigue　life　are　studied.　Three　different　constitutive　models　of　SnAgCu　lead-free　solder　including　viscoplastic　Anand　model,　steady-state　creep　hyperbolic　sine　model　and　double　power　law　model　are　implemented.　In　addition,　three　FE　models　including　full　3D-Quarter　model,　3D-Quarter/Octant　model　with　constraint　equation　(CE)　technique　are　used.　The　volume-averaged　method　is　used　for　accumulated　inelastic　strain　energy　density　calculation.　Zhu＇s　energy　based　fatigue　model　for　QFN　package　is　taken　to　predict　fatigue　life.　The　FE　modeling　results　show　that　the　critical　solder　joint　is　at　the　package　corner　and　crack　is　likely　to　occur　along　lead　and　solder　interface.　The　maximum　accumulated　inelastic　strain　energy　are　located　at　top　layer　elements　of　critical　solder　joint　for　all　solder　constitutive　models　and　FE　models.　The　predicted　fatigue　life　of　dual-row　QFN　package　calculated　from　Anand　model　is　slightly　higher　than　that　from　the　other　two　models.　The　predicted　fatigue　life　obtained　from　different　FE　models　have　almost　the　same　value,　which　indicating　FE　model　with　the　CE　technique　can　well　be　applied　for　fatigue　life　prediction.