The　reliability　of　novel　Quad　Flat　No-Lead　(QFN)　package　design　with　multi-row　lead　fingers　has　not　been　well　analyzed　yet　The　thermal　characterization,　warpage　performance　and　board　level　solder　joint　reliability　of　dual-row　and　conventional　QFN　packages　are　investigated　in　this　paper　for　comparison.　Flotherm　Computational　Fluid　Dynamics　(CFD)　software　is　employed　to　predict　the　package　thermal　performance.　Warpage　performance　is　studied　by　FE　modeling,　and　correlates　with　analytical　results　from　Timoshenko＇s　bi-layer　beam　model.　In　board　level　solder　joint　reliability　comparison　study,　3D-Quarter　finite　element　(FE)　model,　steady-state　creep　hyperbolic　sine　constitutive　model　for　SnAgCu　solder　and　Zhu＇s　energy　based　fatigue　model　are　used.　The　results　show　that　thermal　performance　and　board　level　solder　joint　fatigue　life　of　conventional　QFN　are　slightly　greater　than　that　of　dual-row　QFN.　Warpage　results　based　on　bi-layer　beam　theory　basically　agree　with　FE　modeling　results.