It　is　difficult　to　cool　high　thermal　flux　electronics　by　traditional　methods　such　as　air　cooling,　common　liquid　cooling　and　so　on.　However,　vapor　compressor　refrigeration　system　is　an　efficient　approach　to　solve　this　problem.　Heat　sink　is　important　equipment　in　system,　so　the　goal　of　this　paper　is　to　design　a　heat　sink　which　is　similar　to　an　evaporator　in　vapor　compression　system　with　head　load　100W.　Mathematical　model　of　heat　sink　is　set　up.　Different　heat　flux,　pressure　drop,　heat　transfer　area　and　weight　with　different　micro-channel　width　are　obtained　finally.