This　paper　presents　a　new　way　to　design　a　low-cost　micro-thermoelectric　generator　(mu-TEG)　which　can　be　fabricated　by　using　electrochemical　and　MEMS　technology.　The　overall　dimension　of　the　mu-TEG　is　about　13mm　x　13mm　x　0.4mm,　which　contains　128　p-　and　n-type　pairs　of　semiconductors　connected　electrically　in　series　and　thermally　in　parallel.　The　p-type　antimony　telluride　(Sb2Te3)　and　n-type　bismuth　telluride　(Bi2Te3)　with　an　optimal　thickness　of　20　mu　m　were　designed　to　deposit　in　a　flexible　polymer　mold　formed　by　photolithographic　patterning　of　Polyimide　(PI)　with　a　three　electrode　configuration.　Simulations　of　the　thermocouple　with　PI　mold　were　carried　on,　using　finite　element　analysis.　The　analysis　shows　the　possibility　to　achieve　3.5　mV　while　the　difference　in　temperature　is　10K　and　the　thickness　of　the　silicon　substrate　is　400　mu　m,　which　reveals　that　the　output　power　of　the　thermocouple　without　releasing　process　is　only　4%　lower　than　the　one　with　the　releasing　process.　Therefore　the　PI　mold　is　not　removed,　considering　the　potential　for　easier　fabrication　and　lower　cost.　The　deposition　parameters　were　also　studied　and　optimized　for　the　best　thermoelectric　performance.　In　our　experiments,　the　n-　and　p-type　semiconductors　could　be　obtained　when　the　voltage　and　current　are　around　50mV　versus　saturated　calomel　electrode　(SCE)　and　40　mA,　respectively.