The　Cu-1.0Co-0.65Si-0.1Ti　alloy　was　obtained　by　vacuum　melting,　and　then　the　hot　deformation　experiment　was　carried　out　by　using　the　Gleeble-1500　simulator　at　0.001-10　s(-1)　strain　rates　and　500-900　degrees　C　deformation　temperatures.　The　microstructure　evolution　of　Cu-1.0Co-0.65Si-0.1Ti　alloy　was　discussed.　The　micro　texture　of　Cu-1.0Co-0.65Si-0.1Ti　alloy　was　analyzed　by　EBSD.　With　the　deformation　temperature　increasing　from　700　to　800　degrees　C,　the　dynamic　recrystallization　was　promoted　and　the　texture　of　Cu-1.0Co-0.65Si-0.1Ti　alloy　transformed　from　the　{011}　＜100＞　Goss　texture　to　the　{112}　＜111＞　copper　texture.　The　HAGBs　and　geometrically　necessary　dislocation　(GND)　density　were　calculated,　respectively,　which　can　also　indicate　that　the　increasing　of　temperature　promoted　the　dynamic　recrystallization.　The　critical　strain　for　the　initiation　of　dynamic　recrystallization　in　Cu-Co-Si-Ti　alloy　deformed　at　0.01　s(-1)　,800　degrees　C　and　0.001　s(-1)　,800　degrees　C　was　0.089　and　0.035,　respectively.　And　it　can　be　inferred　that　the　increasing　of　deformation　temperature　or　decreasing　of　strain　rate　can　reduce　the　critical　strain　and　promote　the　dynamic　recrystallization.　Finally,　the　precipitate　was　determined　to　be　Co2Si.