The　rate-dependent　Johnson-Cook　material　model　can　predict　the　stresses　and　strains　of　lead-free　solder　when　the　strain　rate　is　relatively　low　(600　s(-1)).　At　higher　strain　rates　(1200　s(-1)　or　above),　the　stress-strain　curves　predicted　by　Johnson-Cook　model　do　not　agree　well　with　the　experimental　results　when　the　strain　exceeds　a　threshold　value.　In　this　paper,　the　damage　effect　is　considered　into　the　impact　process　of　lead-free　solder　specimens.