With　the　rapid　increase　of　heat　generation,　thermal　interface　material　(TIM)　is　becoming　one　of　the　most　important　materials　of　micro-electronic.　In-based　solder　TIM　has　high　thermal　conductivity,　but　its　high　cost　and　low　mechanical　properties　become　the　obstacles　of　its　application　in　industry.　In　order　to　improve　the　shear　strength　of　In-based　solder-TIM,　we　add　Al　particle　into　melting　InSn　to　produce　InSn-AI　TIM.　At　room　temperature,　the　shear　strength　of　InSn-AI　composite　thermal　interface　material　(CTIM)　was　14.85%　higher　than　InSn　TIM.　This　paper　also　investigates　the　microstructure,　thermal　conductivity　and　resistivity　of　above　two　TIMs.　Our　work　developed　a　background　for　further　study　in　the　mechanical　properties　of　metal　particle　enhanced　InSn-based　TIM.