Charpy　impact　behaviors　of　eutectic　SnBi　solder　joints　with　and　without　presence　of　Joule　heating　effect　were　investigated　by　employing　a　pendulum-type　impact　tester.　The　temperature　rise　induced　by　Joule　heating　effect　at　joined　region　can　reach　to　6.2　degrees　C　and　1.7　degrees　C　when　the　applied　electric　current　was　10　A　and　5　A,　respectively.　In　addition,　the　temperature　distribution　of　solder　joints　during　the　steady-state　heat　conduction　was　more　uninform　due　to　the　sufficient　mass　of　Cu　substrates　at　two　sides.　Most　important,　the　impact　absorbed　energies　were　the　same　regardless　of　how　much　of　electric　current　was　applied.　The　microstructure　observation　confirmed　that　the　fracture　mechanism　was　the　same　between　the　solder　joints　with　and　without　presence　of　Joule　heating　effect.　The　ultimate　results　suggested　that　the　weakness　of　solder　joint　was　located　at　the　interfacial　layer　where　stress　concentration　possibly　arose　due　to　the　interfacial　reaction　and　the　appearance　of　the　Cu6Sn5　and　Bi　brittle　phases.