Dynamic　behavior　of　solder　joints　in　microelectronic　packages　is　key　issue　for　drop/impact　reliability　design　of　mobile　electronic　products.　The　dynamic　mechanical　behaviors　of　63Sn37Pb,　96.5Sn3.5Ag　and　96.5Sn3.0Ag0.5Cu　solder　alloys　at　high　strain　rate　were　investigated　by　using　the　split　Hopkinson　pressure/tension　bar　testing　technique.　Stress-strain　curves　of　the　three　materials　were　obtained　at　strain　rate　600　s(-1),　1200　s(-1)　and　2200　s(-1),　respectively.　The　experimental　results　show　that　all　the　three　materials　are　strongly　strain　rate　dependent.　Among　them　96.5Sn3.5Ag　is　the　most　sensitive　to　strain　rate,　while　96.5Sn3.0Ag0.5Cu　has　the　greatest　yield　stress　and　tensile　strength.　Relations　of　the　tensile　strength,　fracture　strain　and　yield　stress　of　the　materials　with　strain　rate　were　proposed　by　fitting　the　experimental　data.