The　microstructure　and　texture　evolution　of　Ni-5　at%W　(Ni5W)　alloy　substrates　were　investigated　by　in　situ　tensile　testing　along　the　rolling　direction　(RD),　transverse　direction　(TD),　and　at　45°　to　the　RD　(45°-RD),　as　well　as　by　electron　backscatter　diffraction　characterization.　The　tensile　stress　direction　had　a　significant　influence　on　the　texture　evolution.　The　cubic　texture　in　the　Ni-5　at%W　alloy　exhibited　severe　degradation　when　the　tensile　angle　was　45°-RD.　In　contrast,　the　cubic　texture　was　relatively　stable　under　high　deformation　along　the　RD　or　TD.　It　was　found　that　the　slip　line　system　in　the　45°-RD　specimen　was　the　key　to　the　contrasting　behavior.　The　effect　of　the　tensile　testing　angle　on　the　cubic　texture　evolution　for　Ni–W　substrates　was　investigated,　and　the　corresponding　effect　on　the　superconducting　properties　of　coated　materials　was　studied.