Based on the technology of electromagnetic force driving and differential pressure control for producing solder balls - 文章详情页

作者：

Wang, Tongju (Wang, Tongju.) | Lei, Yongping (Lei, Yongping.) (学者：雷永平) | Zhao, Peng (Zhao, Peng.) | Lin, Jian (Lin, Jian.) | Fu, Hanguang (Fu, Hanguang.) (学者：符寒光)

收录：

EI Scopus SCIE

摘要：

Uniform　solder　balls　are　widely　used　in　3D　Printing　and　electronic　packaging.　Therefore,　it　needs　a　simple　method　for　producing　uniform　solder　balls　at　a　higher　quality.　In　this　article,　a　novel　and　simple　method　was　presented　to　produce　uniform　solder　balls　by　the　technology　of　electromagnetic　force　driving　and　differential　pressure　control.　The　results　indicated　that　the　uniform　solder　balls　of　Sn-58Bi　alloy　could　be　produced　by　two　different　modes　of　differential　pressure　control.　The　solder　balls　with　a　spherical　degree　between　0　and　3%　and　diameter　with　a　mean　variation　of　4%　were　produced　at　different　diameter　and　reasonable　test　parameters.　©　2020　Elsevier　B.V.

关键词：

Binary alloys Electronics packaging 3D printers Tin alloys Lead-free solders Bismuth alloys Pressure control

作者机构：

[ 1 ] [Wang, Tongju]Microelectronics Science and Engineering, North China Institute of Aerospace Engineering, Langfang; 065000, China
[ 2 ] [Lei, Yongping]School of Materials Science and Engineering, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Zhao, Peng]Microelectronics Science and Engineering, North China Institute of Aerospace Engineering, Langfang; 065000, China
[ 4 ] [Lin, Jian]School of Materials Science and Engineering, Beijing University of Technology, Beijing; 100124, China
[ 5 ] [Fu, Hanguang]School of Materials Science and Engineering, Beijing University of Technology, Beijing; 100124, China

通讯作者信息：

[wang, tongju]microelectronics science and engineering, north china institute of aerospace engineering, langfang; 065000, china

电子邮件地址：

wangtongju@126.com

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