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作者:

Zhang, M. (Zhang, M..) | Liu, Z. L. (Liu, Z. L..) (学者:刘中良) | Ma, G. Y. (Ma, G. Y..) (学者:马国远)

收录:

CPCI-S

摘要:

Electronics cooling has become a key factor for improving the performance of electronic devices. An effective thermal spreader can remove hot spots, level surface temperature distribution and thus enhance heat dissipation of heat sinks. Flat plate heat pipes are one of the highly effective thermal spreaders. In order to observe boiling and condensation phenomena, a transparent visible flat plate heat pipe is manufactured and the phase change heat transfer characteristics of the heat pipe were studied experimentally. The performance of the flat plate heat pipe with different working fluids was measured under different heat fluxes. The experimental results show that the flat plate heat pipe has a good ability of temperature-leveling and produces a very uniform temperature distribution of the condensation surface. Poor cooling on the external side of the condensation plate deteriorates the performance of the flat plate heat pipe. Within the tested heat flux range in our experiment, the flat plate heat pipe with water as working fluid has a better performance than the flat plate heat pipe with ethanol as working fluid. We also studied the effects of the grooved evaporation surface on enhancing boiling heat transfer. Our experiments prove that the flat plate heat pipe with a grooved evaporation surface has much better performance due to the enhanced heat transfer on the evaporation surface.

关键词:

boiling condensation electronics cooling flat plate heat pipe grooved surface

作者机构:

  • [ 1 ] [Liu, Z. L.]Beijing Univ Technol, Coll Environm & Energy Engn, Beijing Educ Commiss,Minist Educ, Key Lab Enhanced Heat Transfer & Energy Conservat, Beijing 100022, Peoples R China
  • [ 2 ] [Liu, Z. L.]Beijing Univ Technol, Coll Environm & Energy Engn, Beijing Educ Commiss,Minist Educ, Key Lab Heat Transfer & Energy Convers, Beijing 100022, Peoples R China

通讯作者信息:

  • 刘中良

    [Liu, Z. L.]Beijing Univ Technol, Coll Environm & Energy Engn, Beijing Educ Commiss,Minist Educ, Key Lab Enhanced Heat Transfer & Energy Conservat, Beijing 100022, Peoples R China

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来源 :

THERMES 2007: THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS

年份: 2007

页码: 271-,

语种: 英文

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