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摘要：
Fusion bonding with Nd: YAG laser method between silicon and glass at low temperature has been successfully demonstrated. This method could overcome the movable mechanical parts damages brought by the electrostatics force in MEMS (Micro-electronic-machine-system-MEMS) device during the anodic bonding. What＇s more, it could make silicon wafer and glass bonded successfully at low temperature for the Au/Si alloy fusion temperature is 365 degrees C.
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来源 ：
2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS
年份： 2004
页码： 1860-1862
语种： 英文
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